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  This study presents a numerical model to analyze dynamic thermal behavior of a hot chuck designed for
  flip-chip bonders. A series of numerical tests illustrate the usefulness of the
  numerical model in design analysis. Finite element
  model and the basic experimental method have been developed to help the design of the transverse ultrasonic horn for flip-chip bonding.
  Darveaux, R., Islam, M. N., Singh, N., and Suhling, J. C., 2004,
  "Model for BGA and CSP Reliability in Automotive Underhood Application," IEEE Transaction on Components and
  Packaging Technologies, Vol. S. W. Lee, D. J. Choi, C.
  K. Song, and M. G. Chun, "LED Inspection System of Post-Molding Process using Image Processing", Journal of Korean Institute of Information Technology, Vol.
  J. Y. Choi, M. Y. Kim, S. K. Lim, and T. S. Oh, "Flip Chip Process for RF Packages Using Joint Structures of Cu and Sn", J.
  Microelectron. A. Hamdan, A. McLanahan, R. Richards,
  and C. Richards, "Characterization of a liquid-metal microdroplet thermal interface material", Exp.
  A. J. McNamara, Y. Joshi, and Z. M. Zhang, "Characterization of nanostructured thermal interface materials: A review",
  Int. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the
  utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene
  terephthalate).
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